Working of All Section and part Inside Mobile Phone...
Any mobile cell phone including – Samsung, Nokia, LG, Motorola, Sony
Ericsson, Acer, Alcatel, Apple, Amoi, Asus,Blackberry, Blu, Celkon, Dell,
Gigabyte, Haier, HTC,
Huawai, Micromax, lava,
karbonn, lenovo, sigmatel,redmi,
Panasonic, Philips, Sagem, Spice, Toshiba, ZTE Etc have different parts or
sections inside the mobile cell phone. These parts can be divided into
following different sections:
Keyboard or keypad section :
The keyboard section
of any mobile phone is directly connected to the CPU. This means that the row
and column of the key are directly connected to the CPU.
Protector IC or
interface ic diode keypad is linked to the row or column for the protection of
the section. In modern mobile cell phones, which have qwerty keys, a separate
control ic is connected to additional protection.
Display Section:
To achieve a
display signal, the display section is directly connected to the CPU - LCD Data
Signal, LCD Reset Signal, LCD WR Signal, LCD RD Signal, LCD FLM Signal,
LCD
HSYN Signal etc. . These signals are given to the lcd module via CPU. In order
to burn lcd light in keypad mobile, a 2.8 v power supply is supplied by the
CPU. And android phone has a light section,.
Light Section:
The light of android phone burns at approximately 40 v,
and can not give an android phone 40v to the normal method. Therefore Boost
coil with a light IC to boost it, and the input signal 3.2v from the en signal
cpu is given from the signal power ic,
which gives light power by 40v. . Boost
coil, Boost Voltage driver IC, Rectifier Diode etc. are present in this section
Sim Card Section:
The SIM card section
has 6 pins, and the SIM card interface section is directly connected to the CPU
in most mobile cell phones. If there is no power supply in the mobile phone
then the SIM section is connected to the CPU through the power section.
Sim
section mainly consists of vsim (3.0 v), power IC connected, sim rst (2.85 v),
sim CLK, SIM-DATA (2.5 V) directly connected to the CPU and a pin sim GND and
NC ( not Connected). In any set, VSIM NC is connected with 10-18 kg ohm
resistance.
Memory Card Section :
Most of the micro SD cards are now connected to
the mobile cell phone, which is connected to the micro card section through 8
pin socket. The memory card section is created inside the CPU. The details of
these 8 pins are as follows:
- ·
MMC-DATA 2
- ·
MMC-DATA
- ·
MMC-CMD (command)
- ·
MMC-VDD (voltage supply from power ic)
- ·
MMC-CLK
- ·
GND
- ·
MMC-Dta0
- ·
MMC DATA-1
MIC Section :
In most mobile phones, the MIC section is directly connected to
the CPU, but now the smart phone in the mic section is associated with the
audio IC. Working voltage (MIC Bios) (1.8 to 2.8 v) is supplied from the CPU or
power supply section. Data and Clock with pin cpu.
Ear Speaker Section :
In most modern mobile cell phones, which have a separate ear
speaker, it is directly in the CPU. It receives the sound through the signal
from the CPU of the inbuilt audio section within the CPU.
In some mobile
phones, these sound signals are obtained through coils / resistance. Some
mobile phones have audio in the audio section. Some mobile phones have audio
amplifier
Speaker/Ringer Section :
In most mobile phones, ringer, buzzer or speaker are connected
to the audio amplifier IC to get a loud sound. Amplifier increases the sound or
audio signal received from the CPU's audio section of the CPU.
Main Backlight Section:
LED lights are connected in accordance with parallel circuits in
the main backlight section. The anode end of the LED is connected to each other
and all the cathode ends are connected to each other.
Of these - 3 to 3.3 V is
supplied for the operation of LED lights. This power supply is given to the
cathode ends of the LED from the ends of the ground. The power supply is
controlled using the LED-driver or PNR IC until the anode end of the LED lights.LED lights are connected in accordance with parallel circuits in
the main backlight section.
The anode end of the LED is connected to each other
and all the cathode ends are connected to each other. Of these - 3 to 3.3 V is
supplied for the operation of LED lights. This power supply is given to the
cathode ends of the LED from the ends of the ground.
The power supply is
controlled using the LED-driver or PNR IC until the anode end of the LED lights.
Vibrater Motor Section :
Positive power from the battery or cpu is given directly to the
positive terminal of the motor in this section. And one end of the motor is
connected to the CPU.
Network Section:
Antenna, External Antenna Socket, RX-Band Pass Filter, RF
Crystal, FEM, PFO, TX-Band Pass Filter, RF IC, are connected in the Network
section. Signal antenna switch or FEM received on antenna during RX is given
through antenna socket where the next processing is done by selecting the
appropriate band frequency and passing the RF IC through the RX-band pass
filter. .
During the TX, the RF signal from RF IC is given to FEM or PFO to
increase the signal. After the band selection process the signal is passed
through the antenna.
Charging Section:
Charger and system interface connector are built together
in most modern mobile cell phones. Regulator section is made separately for
battery charging section. In some mobile phones, the battery charging section
is made inside the power IC
FM Redio Section:
FM Radio
Driver IC, FM Antenna, Signal and Supply Component are made in the FM Radio
section
Bluetooth Section:
Bluetooth antenna, Bluetooth RF signal filter, Bluetooth driver IC, supply and signal components are made in this section. Bluetooth section works like a network section. RF-CLK signals are given to the Bluetooth driver IC during signal processing.
WI-FI Section:
wi-fi ic creates wifi section with vco. vco
gives wi-fi frequency of approximately 13 mz.
Set Power ON :
Power
IC, CPU (UCP), Flash IC, RF-CLK, Crystal, RF-IF, PWR Kate etc. are present in
this section. Battery positive supply is given to power IC and power over
voltage is obtained on one tip of power when connecting battery (3.7V) from
2.87 to 3.0. Supply is supplied to CPU,
Flash IC, RF-CLK, Generator section (RF
crystal, RF IC), which enables the mobile phone to switch on.
Head free Earphone Section :
Mainly Hands Free Jack, Hands Free MIC, Speaker Signal Component
and Hands Free Audio Amplifier are present in this section. Hands free symbol
is displayed after Hands-free jack connection.
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